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Process Capabilities
FR4 Printed Circuit Boards 2-16 Layers
UL Approved, File #E48920
UL Approved to 4oz. Copper (outer layers)
Panel Scoring
Allied Signal FR406, UL
Nickel Body
Rogers 4003 Teflon
Matte-tin Body
Soldermask Over Bare Copper - HASL
Gold Body
Soldermask Over Nickel - Tin/Lead Pads
Immersion Gold
Liquid Photoimageable Soldermask (LPI)
Surface Mount
Electrical testing (PTH and/or SMT to .020 pitch)
Carbon Paste
Technology Matrix
Attribute
Current
Near Future
Future
Board Thickness

.012 - .200

012 - .200

. 012 - .200

Layer Count

2 – 16

2 – 24

2 - 24

Line Width/Space

5/5-5/5 mil

4/4 – 4/4 mil

3/3 – 4/4 mil

Aspect Ratio (Finished)

8:1

10:1

12:1

Smallest Pad Size

.016

.015

.015

Smallest Finished PTH Dia.

 

 

 

Microvia

.006

.005

.004

Mechanical

.008

.006

.006

Minimum Core Thickness

.005

.004

.003

Maximum Panel size

18X24

18X24

18X24

Registration Tolerance

+/- .004

+/- .004

+/- .003

Impedance Tolerance - 50 ohms

+/- 10%

+/- 7%

+/- 5%

Capacity

6000 SF/ Week

6500 SF / Week

7000 SF / Week

 

 

 

 

 

 

 

REV. 2004

SPRIG CIRCUITS / CIRCUIT LAM TECHNOLOGY MATRIX

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