Capabilities
Coming Soon...
Online Quote Request Form
DFM Services
Process Capabilities
Printed Circuit Boards 2-6 Layers
UL Approved, File #E48920
UL Approved to 4oz. Copper (outer layers)
Panel Scoring
 FR406 FR408 370HR VT-47 VT-48, UL
Nickel Body
Rogers 4003 & 4350
Matte-tin Body
Soldermask Over Bare Copper - HASL
Gold Body
Soldermask Over Nickel - Tin/Lead Pads
ENIG & Immersion Silver
Liquid Photoimageable Soldermask (LPI)
Surface Mount
Electrical testing (PTH and/or SMT to .020 pitch)
Carbon Paste
Technology Matrix
Attribute
Current
Near Future
Future
Board Thickness

.012 - .200

012 - .200

. 012 - .200

Layer Count

2 – 12

2 – 16

2 - 18

Line Width/Space

5/5-5/5 mil

4/4 – 4/4 mil

3/3 – 4/4 mil

Aspect Ratio (Finished)

8:1

10:1

12:1

Smallest Pad Size

.023

.020

.015

Smallest Finished PTH Dia.

 

 

 

Microvia

.008

.007

.006
Mechanical

.010

.009

.008

Minimum Core Thickness

.005

.004

.003

Maximum Panel size

18X24

18X24

18X24

Registration Tolerance

+/- .004

+/- .004

+/- .003

Impedance Tolerance - 50 ohms

+/- 10%

+/- 7%

+/- 5%

Capacity

6000 SF/ Week

6500 SF / Week

7000 SF / Week

 

 

 

 

 

 

 

REV. 2004

SPRIG CIRCUITS TECHNOLOGY MATRIX

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Fax: 707-447-0896
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© 2004 Sprig Circuits, Inc.